Customized Copper Core Metal Core PCB for High-Power Electronics
PCB parameter:
Brand:Oneseine
Application: Full range of fluorescent lamps
Maximum size: 1500mm
Substrate material: Aluminum
Thickness: 0.6-2.0mm
Copper foil thickness: 18-70um
Surface treatment: OSP/HAL/HASL (Lead free)
Thermal conductivity: 1.0 – 3.0W/m.k
Breakdown voltage: 1.0-3.0KV(AC)
Flammability: 94V0
Standard: UL & ROHS
Manufacturing Process: Critical Stages & Parameters
Stage 1: Base Preparation
Material: 5052/6061 Al or C1100 Cu
Surface Treatment: Alkaline wash → Anodization (Al) / Antioxidant coating (Cu)
Flatness Tolerance: ≤0.1mm/m²
Stage 2: Dielectric Lamination
Standard Materials: Bergquist HT-04503 (100μm), Laird Tputty506 (150μm)
Thermal Resistance: <0.3°C-in²/W
Breakdown Voltage: >3kV AC
Stage 3: Circuit Fabrication
Copper Weight Options: 1oz (35μm) to 10oz (350μm)
Etching Precision: ±10% line width tolerance
Min. Trace/Space: 0.15mm/0.15mm (LDI process)
Stage 4: Thermal Management Features
Via Fill: Conductive epoxy (0.8-1.5 W/mK)
Plated Through Holes: Aspect ratio 8:1 max
Edge Plating: 360° coverage for chassis grounding
Quality Validation Protocol
Thermal Cycling
Condition: -55°C ↔ +150°C, 500 cycles (IPC-TM-650 2.6.7)
Acceptance: No delamination, <5% resistance change
Thermal Resistance Test
Method: ASTM D5470
Standard: θja <1.5°C/W (for 1.0mm Al core)
High-Potential Test
Voltage: 3kV AC, 60s (UL 796)
Leakage: <5mA
